Job: Device Modeling Integration & Release Engineer
Locations
Posted: 09/28/2011
Job Type: IT - Hardware/Networking IT - ALL CATEGORIES
Jobing Description
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Skills:
Computer, Engineer, Engineering, Genetics, Hardware, IBM, Modeling, Packaging, Perl, Release, Software
Date Posted:
9-26-2011
Location:
Essex Junction, VT
Area Code:
802
Tax Term:
FULLTIME
Pay Rate:
Length:
Position ID:
STG-0428637
Dice ID:
ibmiirc
Travel Required:
unspecified
Telecommute:
no
Device Modeling Integration & Release Engineer
For someone who enjoys working with both hardware and software. As part of a dynamic and skilled team, you will develop and utilize the software infrastructure for developing semiconductor technology compact device models for 32SOI, 22SOI, and 14nm technologies. Includes the verification, integration, and packaging of these models, plus contribute to new technology enhancements in the models.
Opportunity for customer interface with IBM Server, ASICs, and IBM joint alliance partners on modeling requests and issues, as well as work closely with external tool vendors, e.g. Synopsys and Cadence, and IBM EDA PowerSpice.
Knowledge of HSpice, Spectre, PowerSpice, Verilog-A, and PERL scripting skills a plus.
(STG Profile MBWR-8KBHS7 )
Required
* Bachelor's Degree
Preferred
* Master's Degree in Engineering
* At least 3 years experience in Semiconductor Technology
* At least 3 years experience in Computer Engineering
* English : Fluent
IBM is committed to creating a diverse environment and is proud to be an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, genetics, disability, age, or veteran status.
IBM
Web: http://www.ibm.com/
Apply Now
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